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APTM20DUM04G Dual common source MOSFET Power Module VDSS = 200V RDSon = 4m typ @ Tj = 25C ID = 372A @ Tc = 25C D1 Q1 D2 Q2 Application * AC Switches * Switched Mode Power Supplies * Uninterruptible Power Supplies G2 G1 S1 S S2 G1 S1 Features * Power MOS 7(R) MOSFETs - Low RDSon - Low input and Miller capacitance - Low gate charge - Avalanche energy rated - Very rugged * Kelvin source for easy drive * Very low stray inductance - Symmetrical design - M5 power connectors * High level of integration Benefits * Outstanding performance at high frequency operation * Direct mounting to heatsink (isolated package) * Low junction to case thermal resistance * Low profile * RoHS Compliant D1 S D2 S2 G2 Absolute maximum ratings Symbol VDSS ID IDM VGS RDSon PD IAR EAR EAS Parameter Drain - Source Breakdown Voltage Continuous Drain Current Pulsed Drain current Gate - Source Voltage Drain - Source ON Resistance Maximum Power Dissipation Avalanche current (repetitive and non repetitive) Repetitive Avalanche Energy Single Pulse Avalanche Energy Tc = 25C Tc = 80C mJ These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com 1-7 APTM20DUM04G - Rev 2 July, 2006 Tc = 25C Max ratings 200 372 278 1488 30 5 1250 100 50 3000 Unit V A V m W A APTM20DUM04G All ratings @ Tj = 25C unless otherwise specified Electrical Characteristics Symbol IDSS RDS(on) VGS(th) IGSS Characteristic Test Conditions Min Zero Gate Voltage Drain Current Drain - Source on Resistance Gate Threshold Voltage Gate - Source Leakage Current VGS = 0V,VDS = 200V VGS = 0V,VDS = 160V Typ Tj = 25C T j = 125C VGS = 10V, ID = 186A VGS = VDS, ID = 10mA VGS = 30 V, VDS = 0V 4 3 Max 500 2000 5 5 200 Unit A m V nA Dynamic Characteristics Symbol Ciss Coss Crss Qg Qgs Qgd Td(on) Tr Td(off) Tf Eon Eoff Eon Eoff Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Total gate Charge Gate - Source Charge Gate - Drain Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy Turn-on Switching Energy Turn-off Switching Energy Test Conditions VGS = 0V VDS = 25V f = 1MHz VGS = 10V VBus = 100V ID = 372A Inductive switching @ 125C VGS = 15V VBus = 133V ID = 372A R G = 1.2 Inductive switching @ 25C VGS = 15V, VBus = 133V ID = 372A, R G = 1.2 Inductive switching @ 125C VGS = 15V, VBus = 133V ID = 372A, R G = 1.2 Min Typ 28.9 9.32 0.58 560 212 268 32 64 88 116 3396 3716 3744 3944 Max Unit nF nC ns J J Source - Drain diode ratings and characteristics Symbol Characteristic IS Continuous Source current (Body diode) VSD Diode Forward Voltage dv/dt Peak Diode Recovery trr Reverse Recovery Time Qrr Reverse Recovery Charge Test Conditions Min Typ Tc = 25C Tc = 80C VGS = 0V, IS = - 372A IS = -372A, VR = 133V diS/dt = 400A/s 360 26.8 Max 372 278 1.3 5 Unit A V V/ns ns C July, 2006 2-7 APTM20DUM04G - Rev 2 dv/dt numbers reflect the limitations of the circuit rather than the device itself. IS - 372A di/dt 700A/s VR VDSS Tj 150C www.microsemi.com APTM20DUM04G Thermal and package characteristics Symbol RthJC VISOL TJ TSTG TC Torque Wt Characteristic Junction to Case Thermal Resistance RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz Min 2500 -40 -40 -40 3 2 Typ Max 0.1 150 125 100 5 3.5 280 Unit C/W V C N.m g Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight To heatsink For terminals M6 M5 SP6 Package outline (dimensions in mm) See application note APT0601 - Mounting Instructions for SP6 Power Modules on www.microsemi.com APTM20DUM04G - Rev 2 www.microsemi.com 3-7 July, 2006 APTM20DUM04G Typical Performance Curve Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.12 Thermal Impedance (C/W) 0.1 0.08 0.06 0.04 0.02 0.9 0.7 0.5 0.3 0.1 0.05 0.0001 0.001 0.01 0.1 1 10 Single Pulse 0 0.00001 rectangular Pulse Duration (Seconds) Low Voltage Output Characteristics 1200 VGS=15V 10V 9V 8.5V 8V 7.5V 7V 6.5V 3000 ID, Drain Current (A) 2500 2000 1500 1000 500 0 Transfert Characteristics VDS > ID(on)xRDS (on)MAX 250s pulse test @ < 0.5 duty cycle ID, Drain Current (A) 1000 800 600 400 200 0 TJ=25C TJ=125C TJ=-55C 0 4 8 12 16 20 24 28 0 VDS , Drain to Source Voltage (V) RDS(on) vs Drain Current 1.2 ID, DC Drain Current (A) Normalized to V GS=10V @ 186A 1 2 3 4 5 6 7 8 9 10 VGS, Gate to Source Voltage (V) RDS(on) Drain to Source ON Resistance DC Drain Current vs Case Temperature 400 350 300 250 200 150 100 50 0 25 50 75 100 125 150 July, 2006 4-7 APTM20DUM04G - Rev 2 1.1 1 VGS=10V VGS=20V 0.9 0.8 0 100 200 300 400 500 600 ID, Drain Current (A) TC, Case Temperature (C) www.microsemi.com APTM20DUM04G RDS(on), Drain to Source ON resistance (Normalized) Breakdown Voltage vs Temperature BVDSS, Drain to Source Breakdown Voltage (Normalized) 1.15 1.10 1.05 1.00 0.95 0.90 -50 -25 0 25 50 75 100 125 150 TJ, Junction Temperature (C) Threshold Voltage vs Temperature 1.2 VGS(TH), Threshold Voltage (Normalized) ID, Drain Current (A) 1.1 1.0 0.9 0.8 0.7 0.6 -50 -25 0 25 50 75 100 125 150 TC, Case Temperature (C) Capacitance vs Drain to Source Voltage 100000 Ciss C, Capacitance (pF) 10000 Coss ON resistance vs Temperature 2.5 2.0 1.5 1.0 0.5 0.0 -50 -25 0 25 50 75 100 125 150 TJ, Junction Temperature (C) Maximum Safe Operating Area 10000 VGS=10V ID= 186A 1000 limited by RDSon 100s 1ms 100 Single pulse TJ=150C TC=25C 1 10ms 100ms 10 1 10 100 1000 VDS, Drain to Source Voltage (V) VGS, Gate to Source Voltage (V) Gate Charge vs Gate to Source Voltage 14 I D=372A V DS=40V 12 TJ =25C 10 8 6 4 2 0 0 80 160 240 320 400 480 560 640 Gate Charge (nC) July, 2006 VDS=100V VDS=160V 1000 Crss 100 0 10 20 30 40 50 VDS, Drain to Source Voltage (V) www.microsemi.com 5-7 APTM20DUM04G - Rev 2 APTM20DUM04G Delay Times vs Current 120 100 t d(on) and td(off) (ns) 80 60 40 20 0 0 100 200 300 400 500 I D, Drain Current (A) 600 VDS=133V RG=1.2 T J=125C L=100H Rise and Fall times vs Current 160 140 t r and tf (ns) V DS=133V R G=1.2 T J=125C L=100H t d(off) 120 100 80 60 40 20 0 0 tf t d(on) tr 100 200 300 400 500 ID, Drain Current (A) 600 Switching Energy vs Current 8 Switching Energy (mJ) 6 4 2 Eoff 0 0 100 200 300 400 500 600 I D, Drain Current (A) Operating Frequency vs Drain Current VDS=133V D=50% RG=1.2 T J=125C T C=75C ZVS ZCS Hard switching VDS=133V RG=1.2 TJ=125C L=100H Switching Energy vs Gate Resistance 12 V DS=133V ID=372A T J=125C L=100H Eoff Eon 10 8 6 4 2 0 Eon and Eoff (mJ) Eoff Eon 2.5 5 7.5 10 12.5 Gate Resistance (Ohms) Source to Drain Diode Forward Voltage IDR, Reverse Drain Current (A) 1000 TJ=150C 350 300 Frequency (kHz) 250 200 150 100 50 0 50 100 150 200 250 300 350 I D, Drain Current (A) 100 TJ =25C 10 1 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 July, 2006 VSD, Source to Drain Voltage (V) Microsemi reserves the right to change, without notice, the specifications and information contained herein Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved. www.microsemi.com 6-7 APTM20DUM04G - Rev 2 APTM20DUM04G www.microsemi.com 7-7 APTM20DUM04G - Rev 2 July, 2006 |
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